• 616.554.9820

ELECTRONIC ASSEMBLIES

At Amphenol Borisch Technologies we understand that high reliability electronics requires state-of-the art equipment, experienced and passionate people, and rigorous process validation.  We work closely with our customers during the New Product Introduction (NPI) stage to ensure that products meet or exceeds all requirements and expectations right from the very start of the project. 

Product Capabilities:

  • Automated Select Solder, Press-fit and Hand Solder for Through Hole
  • Single & Double-sided BGA’s and uBGAs
  • High Density Packages (0201)
  • Chip on Board
  • Lead-free
  • Conformal Coat: UR, UL and Parylene

Process Validation Capabilities:

  • 3D Solder Paste Inspection (SPI)
  • Pre and Post-Reflow Automated Optical Inspection (AOI)
  • 3D X-ray
  • Aqueous and Non-aqueous (vapor) Cleaning Chemistries

  • 4511 East Paris Ave,
    Grand Rapids, MI 49512
  • 616.554.9820
  • 616.554.9821
  • This email address is being protected from spambots. You need JavaScript enabled to view it.

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